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  • Article
    Citation - WoS: 6
    Citation - Scopus: 7
    Construction of Self-Assembled Vertical Nanoflakes on Cztsse Thin Films
    (Iop Publishing Ltd, 2019) Terlemezoglu, M.; Surucu, O. Bayrakli; Colakoglu, T.; Abak, M. K.; Gullu, H. H.; Ercelebi, C.; Parlak, M.
    Cu2ZnSn(S, Se)(4) (CZTSSe) is a promising alternative absorber material to achieve high power conversion efficiencies, besides its property of involving low-cost and earth-abundant elements when compared to Cu(In, Ga) Se-2 (CIGS) and cadmium telluride (CdTe), to be used in solar cell technology. In this study, a novel fabrication technique was developed by utilizing RF sputtering deposition of CZTSSe thin films having a surface decorated with self-assembled nanoflakes. The formation of nanoflakes was investigated by detailed spectroscopic method of analysis in the effect of each stacked layer deposition in an optimized sequence and the size of nanoflakes by an accurate control of sputtering process including film thickness. Moreover, the effects of substrate temperature on the formation of nanoflakes on the film surface were discussed at a fixed deposition route. One of the main advantages arising from the film surface with self-assembled nanoflakes is the efficient light trapping which decreases the surface reflectance. As a result of the detailed production and characterization studies, it was observed that there was a possibility of repeatable and controllable fabrication sequence for the preparation of CZTSSe thin films with self-textured surfaces yielding low surface reflectance.
  • Article
    Citation - WoS: 14
    Citation - Scopus: 14
    Temperature Dependence of Electrical Properties in In/Cu2< Diodes
    (indian Acad Sciences, 2019) Gullu, H. H.; Yildiz, D. E.; Surucu, O. Bayrakli; Terlemezoglu, M.; Parlak, M.
    Cu2ZnSnTe4 (CZTTe) thin films with In metal contact were deposited by thermal evaporation on monocrystalline n-type Si wafers with Ag ohmic contact to investigate the device characteristics of an In/CZTTe/Si/Ag diode. The variation in electrical characteristics of the diode was analysed by carrying out current-voltage (I-V) measurements in the temperature range of 220-360 K. The forward bias I-V behaviour was modelled according to the thermionic emission (TE) theory to obtain main diode parameters. In addition, the experimental data were detailed by taking into account the presence of an interfacial layer and possible dominant current transport mechanisms were studied under analysis of ideality factor, n. Strong effects of temperature were observed on zero-bias barrier height (Phi(B0)) and n values due to barrier height inhomogeneity at the interface. The anomaly observed in the analysis of TE was modelled by Gaussian distribution (GD) of barrier heights with 0.844 eV mean barrier height and 0.132 V standard deviation. According to the Tung's theoretical approach, a linear correlation between Phi(B0) and n cannot be satisfied, and thus the modified Richardson plot was used to determine Richardson constant (A*). As a result, A* was calculated approximately as 120.6 A cm(-2) K-2 very close to the theoretical value for n-Si. In addition, the effects of series resistance (R-s) by estimating from Cheng's function and density of surface states (N-ss) by taking the bias dependence of effective barrier height, were discussed.