Research on PCB defect detection using artificial intelligence: a systematic mapping study

dc.authorscopusid58966313400
dc.authorscopusid57271674300
dc.contributor.authorUral, Dogan Irmak
dc.contributor.authorSezen, Arda
dc.contributor.otherComputer Engineering
dc.date.accessioned2024-07-05T15:22:50Z
dc.date.available2024-07-05T15:22:50Z
dc.date.issued2024
dc.departmentAtılım Universityen_US
dc.department-temp[Ural, Dogan Irmak; Sezen, Arda] Atilim Univ, Dept Comp Engn, TR-06830 Ankara, Turkiyeen_US
dc.description.abstractSMT (Surface Mount Technology) has been the backbone of PCB (Printed Circuit Board) production for the last couple of decades. Even though the speed and accuracy of SMT have been drastically improved in the last decade, errors during production are still a very valid problem for the PCB industry. With the exponential rise of Artificial Intelligence in the last decade, the SMT industry was one of the most eager industries to use this new technology to detect possible defects during production. Lately, traditional image processing techniques started to lag behind methods such as machine learning and deep learning when the discussion came to the need of high accuracy. In this paper, we screen academic libraries to understand which of the latest methods and techniques are used in the domain and to deduce a general process for detecting defects in PCBs. During the research we have investigated research questions related to state-of-the-art methods, highly mentioned datasets, and sought after PCB defects. All findings and answers are mapped to be able to understand where this pursuit might point towards. From a total of 270 papers, 90 of them were addressed in detail and 78 papers were chosen for this systematic mapping.en_US
dc.identifier.citation0
dc.identifier.doi10.1007/s12065-024-00930-x
dc.identifier.issn1864-5909
dc.identifier.issn1864-5917
dc.identifier.scopus2-s2.0-85189201281
dc.identifier.scopusqualityQ2
dc.identifier.urihttps://doi.org/10.1007/s12065-024-00930-x
dc.identifier.urihttps://hdl.handle.net/20.500.14411/2244
dc.identifier.wosWOS:001195694000001
dc.institutionauthorSezen, Arda
dc.language.isoenen_US
dc.publisherSpringer Heidelbergen_US
dc.relation.publicationcategoryDiğeren_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectArtificial intelligenceen_US
dc.subjectImage processingen_US
dc.subjectDefect detectionen_US
dc.subjectPCBen_US
dc.subjectSystematic mappingen_US
dc.titleResearch on PCB defect detection using artificial intelligence: a systematic mapping studyen_US
dc.typeReviewen_US
dspace.entity.typePublication
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relation.isAuthorOfPublication.latestForDiscovery367853fe-83ca-445e-a3be-00c62fcb4e35
relation.isOrgUnitOfPublicatione0809e2c-77a7-4f04-9cb0-4bccec9395fa
relation.isOrgUnitOfPublication.latestForDiscoverye0809e2c-77a7-4f04-9cb0-4bccec9395fa

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